| 摘要 |
An IC has a multiplicity of electrodes or terminals arranged in a grid array configuration. The IC is provided with a multiplicity of pads in a similar grid array configuration. The pads other than the outermost pads of the array are used as signal pads. The outermost pads are used as reinforcing pads, which are connected to the signal pads adjacent the reinforcing pads. Bumps provided on the reinforcing pads and on the signal pads connected to the reinforcing pads are connected to associated bumps en bloc on an assembly board, thereby allowing the IC to be bonded to the assembly board with sufficient mechanical strength.
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