| 摘要 |
Heat sink has fins on the top surface thereof and pin portions on the bottom surface thereof. Rivets having longitudinal through-hole are inserted into holes in a retention module. When the heat sink and the retention module are simultaneously pressed downward, the rivets are inserted into the corresponding holes formed in a base board. The pin portions are inserted into the through-holes of the rivets so that the retention module is locked onto the base board and the heat sink is fixed and the bottom surface of the heat sink is contacted with an integrated circuit element, at the same time.
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