| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a surface-mounting package which is manufactured simply without using special components like a reed. <P>SOLUTION: The method includes: a first process for forming a plurality of annular holes 23 of a predetermined length to ambients of an element loading portion decided beforehand on a surface of a metal substrate 11 by half etching; a second process for filling the annular holes 23 with low melting point powder ceramics 24 and melting and curing them by heating; a third process for exposing the annular holes 23 from a rear face side by performing half etching on the rear face of the substrate 11; a fourth process for mounting a semiconductor element on an element loading portion and connecting electrically the terminal portion exposed from surface side with the semiconductor element; and a fifth process for putting a metal housing covering the semiconductor element and the terminal portion exposed from surface side and joining ambients of the housing to the substrate 11. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
