| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To cope with the microfabrication of an electrode pitch by improving reliability of electric connection and suppressing deformation of a bump upon ultrasonic flip chip bonding. <P>SOLUTION: A circuit substrate 22 is retained by a substrate retaining unit 23 mounted on a table 24 movable into biaxial directions. A semiconductor chip 21 is sucked and retained by an suction head 25, then a holder 45 for supporting the suction head through ultrasonic horns 26, 28 and boosters 29, 31 is lowered by a driving means 34 to push the semiconductor chip against the circuit substrate. In this state, ultrasonic oscillation is impressed on the semiconductor chip, and a ball bump provided previously on the semiconductor chip, from two sets of first and second ultrasonic horns 26, 28 which are provided so as to be contacted with the suction head from two different directions to bond them. The bonding section of the bump bonded in such a manner is provided with a substantially circular configuration, and a bonding strength sufficient enough to obtain the reliability of electric connection. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
