| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a metal-coated substrate capable of reducing manufacturing costs without undergoing troublesome processes, such as the film formation of a carrier layer and dissolution removal. SOLUTION: A metal thin film 2 is formed by plating baths 24-25 at a metal thin film formation section 20 on the surface of a stainless steel belt-like base 1 that revolutionally moves in a peripheral direction, a plastic film layer 3 for a substrate is formed on the metal thin film 2 at a plastic-coated section 30, and the base 1 is peeled off at an interface with the metal thin film 2 at a peeling section 40, thus transferring the metal thin film 2 to the plastic film layer 3 for the substrate and hence obtaining the metal-coated substrate 5 having the metal thin film 2 on the plastic film layer 3 for the substrate. COPYRIGHT: (C)2005,JPO&NCIPI |
