CHEMICAL MECHANICAL POLISHING DEVICE FOR CONTROLLING THE PLANARITY OF A WAFER FOR EACH ZONE BY CONTROLLING RPM(REVOLUTION PER MINUTE) OF A MOTOR BY AN OPERATOR

摘要

PURPOSE: A chemical mechanical polishing device is provided to improve the planarity of a wafer by controlling RPM of plural rotary rollers mounted with a polishing pad individually or for each zone. CONSTITUTION: A chemical mechanical polishing device is composed of a polishing head(20) for sucking a wafer(W) and a polishing station having a polishing unit for grinding the wafer. The polishing unit comprises a plurality of rotating bodies; polishing pads(12) arranged on the upper ends of the rotating bodies; a platen(10) for supporting the rotating bodies; a driving unit for turning the rotating bodies; and a control unit(16) for controlling the driving unit. The driving unit comprises motors(M) for rotating and driving individually each rotating body. The RPM of the motors are controlled individually by the control unit.