发明名称 PLASMA TREATMENT METHOD
摘要 PROBLEM TO BE SOLVED: To prevent damages by making a potential difference between linear conductive interconnections and other elements small when irradiating plasmas in plasma treatment of a substrate with the linear conductive interconnections. SOLUTION: Of a pair of electrodes 11 and 20 of plasma treatment equipment, one of the electrodes 11 and thus a plasma treatment space P has an elongated shape along one direction. The electrode 11 and thus the space P is longer than the linear conductive interconnections 91 of the substrate 90. At the time of treatment with the conductive interconnections 91 being in such a position as to be nearly parallel with the electrode 11 and thus the plasma treatment space P, the substrate 90 is moved in a direction crossing the electrode 11 and thus the plasma treatment space P. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005064191(A) 申请公布日期 2005.03.10
申请号 JP20030291621 申请日期 2003.08.11
申请人 SEKISUI CHEM CO LTD 发明人 NAKAJIMA SETSUO
分类号 H01L21/3065;(IPC1-7):H01L21/306 主分类号 H01L21/3065
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