BOARD CUTTING TYPE PROBE FOR COPING WITH FINE PITCH BY ATTACHING THE SAME VERTICALLY TO SPACE TRANSFORMER AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: A board cutting type probe and a method for fabricating the same are provided to cope with a fine pitch and a variable configuration of pad arrangement of a semiconductor device by being attached vertically to a space transformer of a probe card. CONSTITUTION: A board cutting type probe includes a body and two incision portions. A quadrangular shaped body(10) is formed with a conductive material. The incision portions(12,16) are formed by slitting to the extent of a predetermined length toward a center from each edge of the body, and by bending a slitted portion upwardly and inwardly to the extent of a predetermined angle. Two or more of incision portions are formed on the body. The incision portions are further provided with a contact portion(14,18) formed by bending the end of the incision portions to the extent of a predetermined angle.