BGA package having semiconductor chip with edge-bonding metal patterns formed thereon and method of manufacturing the same

摘要

The present invention relates to a BGA package having center-bonding type semiconductor chips with edge-bonding metal patterns formed thereon wherein the edge-bonding metal patterns are formed on the semiconductor chips in a wafer level, and wire bonding is carried out in the shape of edge bonding so that a plurality of semiconductor chips are stacked, whereby high-density memory performance is obtained, and a method of manufacturing the same.