LSI PACKAGE WITH INTERFACE MODULE AND HEAT SINK USED FOR IT

摘要

PROBLEM TO BE SOLVED: To improve yield and reduce cost by cooling each of a signal processing LSI and an interface module effectively without involving large change in constitution and complication of structure even if they are mounted on the same interposer. SOLUTION: The LSI package with an interface module has an interposer 1 provided with an electric terminal for connecting a packaging board whereon a signal processing LSI 3 is mounted, an interface module 35 for signal transmission mechanically connected to the interposer 1 and electrically connected to the signal processing LSI 3 and one heat sink 9 which is provided in contact with the signal processing LSI 3 and the interface module 35 each and diffuses heat of the signal processing LSI 3 and the interface module 35. A clearance 11 as a heat resisting part is provided between a heat dissipating part of the signal processing LSI 3 and a heat dissipating part of the interface module 35 to the heat sink 9. COPYRIGHT: (C)2005,JPO&NCIPI