Aqueous Dispersion, Chemical Mechanical Polishing Aqueous Dispersion Composition, Wafer Surface Polishing Process and Manufacturing Process of a Semiconductor Apparatus,申请号KR20000001944-传众专利搜索

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发明名称	Aqueous Dispersion, Chemical Mechanical Polishing Aqueous Dispersion Composition, Wafer Surface Polishing Process and Manufacturing Process of a Semiconductor Apparatus
摘要
申请公布号	KR100472882(B1)	申请公布日期	2005.03.07
申请号	KR20000001944	申请日期	2000.01.17
申请人		发明人
分类号	C09K3/14;C09G1/02;H01L21/3105;H01L21/321;(IPC1-7):C09K3/14	主分类号	C09K3/14
代理机构		代理人
主权项
地址

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