| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electroless gold plating technique for performing electroless gold plating on a nickel plating under-layer formed on a conductor circuit, which effectively inhibits separation phenomenon at solder/nickel interface formed through soldering of the gold plating and the nickel plating under-layer. <P>SOLUTION: In the electroless gold plating method, the nickel plating for forming the under-layer is performed on the conductor circuit, and the electroless gold plating is performed on the nickel plating under-layer. After the nickel plating, the surface of the nickel plating under-layer is subjected to gold- or palladium-catalyzed activation treatment and subsequently to reductive gold plating. Alternatively, after the nickel plating, reductive palladium plating and electroless gold plating are successively performed. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
