| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of rewinding an Au superfine wire on a spool keeping it highly rectilinear, where the Au superfine wire is employed as a bonding wire used for connecting the chip electrode of a semiconductor device, such as transistors, LSIs, ICs or the like, to an external lead. <P>SOLUTION: The method is that the Au superfine wire 3 wound on a delivery bobbin 1 is rewound on a take-up spool while tension is applied to the wire 3. Provided that 0.2% yield strength possessed by the Au superfine wire 3 is represented by σ<SB>0.2</SB>(MPa), the wire 3 is wound on the take-up spool while tension of σ<SB>T</SB>(MPa) satisfying formula, 0.01σ<SB>0.2</SB>≤σ<SB>T</SB>≤0.8σ<SB>0.2</SB>, is applied to the wire 3, and while the advancing direction of the wire 3 is so curved as to set a radius of curvature at 1 mm or above. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
