| 摘要 |
The invention relates to assembling an integrating component on the substrate of a radiocommunication module used for receiving at least one surface-mounted component. Said integrating component comprises at least one surface section which is parallel to the surface of the substrate (31, 32) and extended outside thereof and at least one section (33) which is perpendicular with respect to the substrate surface (31, 32) and at least partly supported (34) by said substrate. The inventive method consists in placing at least one substrate on a support used for this purpose, applying a solder paste to each substrate, placing at least one surface-mounted component on each substrate, placing said integrating component on each substrate and in soldering by simultaneously fixing one or several surface-mounted components and the integrating component to each substrate. |
