发明名称 |
Integrated circuit with reverse engineering protection |
摘要 |
<p>Technique and structures for camouflaging an integrated circuit structure. The integrated circuit structure is formed by a plurality of layers of material having controlled outlines and controlled thicknesses. A layer of dielectric material of a controlled thickness is disposed among said plurality of layers to thereby render the integrated circuit structure intentionally inoperable.</p> |
申请公布号 |
GB2405531(A) |
申请公布日期 |
2005.03.02 |
申请号 |
GB20040027115 |
申请日期 |
2003.05.06 |
申请人 |
* HRL LABORATORIES LLC;* RAYTHEON COMPANY |
发明人 |
LAP-WAI * CHOW;WILLIAM M * CLARK JR;JAMES P * BAUKUS |
分类号 |
H01L21/331;H01L21/822;H01L21/8238;H01L21/8247;H01L23/58;H01L27/02;H01L27/04;H01L27/092;H01L27/115;H01L29/732;H01L29/78;H01L29/788;H01L29/792;(IPC1-7):H01L27/02 |
主分类号 |
H01L21/331 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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