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发明名称
Verwendung eines Laserschneidverfahrens
摘要
申请公布号
DE19857835(B4)
申请公布日期
2005.02.17
申请号
DE1998157835
申请日期
1998.12.15
申请人
SIEMENS AG
发明人
BAIER, KARL-HEINZ
分类号
B23K26/382;B23K26/402;B26F1/26;B29C67/00;B60K35/00;G01D11/26;(IPC1-7):B29C71/02;B60K37/00;G01D13/00;B29C37/00;B23K26/00;B29C71/04
主分类号
B23K26/382
代理机构
代理人
主权项
地址
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