发明名称 MOLD AND MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To enhance the connection strength of molded products respectively molded from two kinds of resins. SOLUTION: In this mold assembly, the first gate 30 connected to a first cavity 25 is provided to a first mold member 1 and the first resin passage 31 connected to the first gate 30 is provided to the first mold member 1. The second gate 44 connected to the first cavity 25 is provided to a second mold member 2 and a gate pin 45, of which the leading end surface 47 can come into contact with the first mold member 1 in the first cavity 25, is provided not only to the hole 46 connected to the second gate 44 in a freely sliding state but also to the first cavity 25 in a freely accessible manner. The leading end 52A of a second resin passage 51 is connected to the hole 46 and provided to the space 84 between the second gate 44 and the retreat position of the leading end surface 47 of the gate pin 45. This mold assembly is constituted so that a second cavity 27 is filled with a second resin 86 through the first through-hole 82 formed to a first molded product 26 in a first process. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005040986(A) 申请公布日期 2005.02.17
申请号 JP20030200096 申请日期 2003.07.22
申请人 MITSUBISHI MATERIALS CORP 发明人 YAMAMOTO KUNIO;HORIKAWA YOSHIHIRO
分类号 B29C45/26;B29C45/16;(IPC1-7):B29C45/26 主分类号 B29C45/26
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