| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem in which peeling-off of a film or scattering thereof occurs during a manufacturing process on a wafer, and causes smearing of a wafer or of the apparatus when an insulating film and/or a metal film are formed on a part of each chip area which is protruded from the exposure region in a near peripheral-edge region of a wafer. SOLUTION: A positive resist film is formed on a substrate on which an insulating film is formed. The resist film is exposed in a separate manner with a plurality of shots, and the exposed resist film is developed to form a resist pattern. In the exposure, when a shot covers a peripheral region of the substrate, the light for the exposure is blocked by a light-blocking band in order not to expose the peripheral region to form a mask by the resist on the peripheral region of the substrate. COPYRIGHT: (C)2005,JPO&NCIPI
|
