发明名称 METHOD OF MANUFACTURING PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing printed wiring board in which a capacitor and an inductor element are formed in a printed wiring board in the manufacturing process of the wiring board, and by which the accuracy of the capacitance of the capacitor can be improved and the fluctuation of the capacitance can be reduced. SOLUTION: At the time of forming the capacitor and inductor element in the printed wiring board in the manufacturing process, the lower electrode 4 of the capacitor is formed by the subtractive method used for etching metal foil 2, and the upper electrode 7 of the capacitor is formed by the additive method or semi-additive method used for plating a metal. The area of the lower electrode 4 is made larger than that of the upper electrode 7. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005045099(A) 申请公布日期 2005.02.17
申请号 JP20030278869 申请日期 2003.07.24
申请人 TOPPAN PRINTING CO LTD 发明人 SEKINE HIDEKATSU;FUKADA TAKAYUKI
分类号 H05K1/16;H05K1/09;(IPC1-7):H05K1/16 主分类号 H05K1/16
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