| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which a bump, i.e. a solder ball, is melted and bonded easily to an electrode at the time of reflow for flip-chip bonding thus establishing electrical connection, and to provide its manufacturing method. <P>SOLUTION: Individual electrode terminals for connection on a wafer on which a semiconductor device chip or a semiconductor device is formed are coated with flux containing fine metal particles and then a solder ball or a metal ball is fixed on the flux. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
