| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a three-dimensionally mounted semiconductor device wherein an electric power can be applied to boards, and the boards communicate with each other to transmit or receive signals correctly. <P>SOLUTION: A semiconductor device 1 is composed of boards 100, 200, and 300 which are stacked up and equipped with integrated circuits 105. The boards are each equipped with a translucent board main body 101, a light emitting element which is capable of converting electric signals to optical signals and transmitting them, light receiving elements 122 and 123 which are capable of receiving optical signals and converting them to electric signals, and a through electrode 160 which supplies a power to the boards. The through electrodes 160 of the adjacent boards are electrically connected together. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
