发明名称 |
ELECTRONIC APPARATUS DEVICE AND HEAT DISSIPATING METHOD FOR ELECTRONIC APPARATUS DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To obtain an electronic device apparatus which can dissipate heat via a cradle even when a casing temperature of the electronic device is raised by placing a portable small-sized electronic device on the cradle and using if for a long period of time. SOLUTION: A method for heat dissipating the electronic device apparatus includes a step of dissipating heat transferred to a contact 55 of a semi-circular recess of the cradle 2 from a heat dissipating part provided on the back surface of the cradle 2 via the bottom plate 41D of a frame member 42 arranged in contact with the opening 54 of the electronic apparatus 1. COPYRIGHT: (C)2005,JPO&NCIPI |
申请公布号 |
JP2005039019(A) |
申请公布日期 |
2005.02.10 |
申请号 |
JP20030199449 |
申请日期 |
2003.07.18 |
申请人 |
SONY CORP |
发明人 |
AMATATSU SEIYA;TAKAHASHI NOBUTATSU;MORIKAWA MASAYOSHI |
分类号 |
H04N5/225;H04N101/00;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H04N5/225 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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