| 发明名称 |
ELECTRONIC DEVICE AND METHOD OF FORMING MULTILAYER WIRING |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a planarization method that allows a highly reliable wiring system and a superconductor device to be formed, and a wiring structure. SOLUTION: To planarize an insulation film layer by forming a reverse pattern of wiring to selectively remove an insulation film on the wiring. COPYRIGHT: (C)2005,JPO&NCIPI
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| 申请公布号 |
JP2005039244(A) |
申请公布日期 |
2005.02.10 |
| 申请号 |
JP20040187582 |
申请日期 |
2004.06.25 |
| 申请人 |
HITACHI LTD;NEC CORP;INTERNATL SUPERCONDUCTIVITY TECHNOLOGY CENTER |
发明人 |
HINODE KENJI;NAGASAWA SHUICHI;KITAGAWA YOSHIHIRO;HIDAKA MUTSUO;TANABE KEIICHI |
| 分类号 |
H01L39/06;H01L21/3205;H01L23/52;H01L39/22;(IPC1-7):H01L21/320 |
主分类号 |
H01L39/06 |
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