| 摘要 |
<p>Materials are bonded by applying a layer of a polyimide prepolymer with a low mol. wt. on the surfaces of the materials, and bonding the materials by exercising pressure at an elevated temp., the prepolymer being prepared by the reaction of stoichiometric quantities of a diamine, dianhydride and maleic anhhdride. Used for bonding rubbers, plastics, ceramics, metals, and/or glass fibres. The bonds are resistant to high temp. Esp. useful for bonding aircraft and space components.</p> |
