| 摘要 |
A wave soldering apparatus includes a solder reservoir within which a pool of molten solder is held at a suitable temperature by heaters. Each heater has an electric heating element and a cover mounted to the solder reservoir to protect the heating element from the molten solder. A solder wave nozzle is submerged in the pool of molten solder and includes a nozzle housing within which a baffle is mounted, and a nozzle head mounted to the nozzle housing and having nozzle openings. An impeller pump includes an impeller housing communicated with the nozzle housing and an impeller connected to a motor. The impeller is driven to draw the molten solder into the impeller, pump the molten solder up through the nozzle housing and force the molten solder through the nozzle opening to form a solder wave through which a printed circuit board to be solder passes. The nozzle housing, the baffle, the nozzle head, the heater cover, the impeller housing, and the impeller are all made of stainless steel and surface-treated with nitrogen.
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