发明名称 |
Verfahren zur Herstellung einer direkt mit einer Polyimidfolie verbundenen dünnen Kupferschicht |
摘要 |
<p>Provided is a thin copper film directly bonded polyimide film in which a thin copper film is directly and strongly connected to a polyimide film. This thin copper film directly bonded polyimide film includes a polyimide film modified by bonding an organic silane compound having a cyano group represented by formula -Si(R-CN)n (wherein R represents alkyl group having 1 to 6 carbon atoms and n represents a positive number from 1 to 3) to a carbon atom on the surface of the polyimide film, and a thin copper film directly bonded to the modified surface of the polyimide film.</p> |
申请公布号 |
DE60017111(D1) |
申请公布日期 |
2005.02.03 |
申请号 |
DE2000617111 |
申请日期 |
2000.10.09 |
申请人 |
NATIONAL UNIVERSITY CORP. SHIZUOKA UNIVERSITY, SHIZUOKA |
发明人 |
INAGAKI, NORIHIRO;TASAKA, SHIGERU |
分类号 |
B32B15/088;C08J7/12;C23C14/02;C23C14/20;C23C28/02;H05K1/03;H05K3/38;(IPC1-7):C08J7/12 |
主分类号 |
B32B15/088 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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