Manufacturing packages with electrical, electronic, micromechanical components or microelectromechanical systems involves providing protective wafer of ceramic, metal or plastic

摘要

The method involves applying protection (4) to the front of a wafer (2) with components, thinning the wafer from the rear and separating the components with the associated part of the protection, whereby the protection arrangement provides protection both during thinning and separating and also during proper use of the component and consists of a protective wafer of ceramic, metal or plastic : An independent claim is also included for the following: (a) a package manufactured in accordance with the inventive method.