| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plasma processing method and a device, which are capable of processing a desired micro part easily and precisely. <P>SOLUTION: The plasma processing method comprises processes of feeding an electric power to an electrode provided to a micro plasma source or a work as an object of processing to generate micro plasma as gas is fed to the micro plasma source arranged near to the work, and making the generated active particles act on the work so as to process the surface micro part of the work. The micro plasma source is composed of an external board 21, internal boards 22 and 23, and an external board 24. An external gas flow path 51 and an external gas exhaust nozzle 52 are provided to the external boards 21 and 24, and an internal gas flow path 53 and an internal gas exhaust nozzle 54 are provided to the internal boards 22 and 23. Interconnect lines for feeding a high-frequency power to an electrode 50 are provided passing through through-holes bored in the external boards 21 and 24. The spouting directions of the exhaust nozzles are so set as to blow gas against the surface segment of the work undergoing processing or the gas exhaust nozzles are formed into a prescribed shape, whereby a micro part of the work can be stably and precisely processed. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
