发明名称 HIGH PRESSURE HEAT TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a high pressure heat treatment apparatus which can perform pressure increasing or decreasing operation in a load-lock chamber during the heat treatment of an object in a high pressure heat treatment chamber having high pressure always kept therein, can perform the loading/unloading operation of the object, can perform quick heat treatment on the object having a large diameter, and can increase a throughput. SOLUTION: The heat treatment apparatus comprises a high pressure treatment chamber 10 for accommodating a single sheet of an object w and performing predetermined heat treatment on the object in a high pressure atmosphere; a transportation chamber 30 connected to the high pressure treatment chamber 10 via a shielding door 20 and having nearly the same pressure as in the high pressure treatment chamber 10 kept herein, and a load-lock chamber 60 connected at its one end to the transportation chamber 30 via a first gate valve 40 and opened at the other end to the atmosphere via a second gate valve 50 for moving the object w up or down to load and unload the object thereinto and therefrom. A transportation mechanism 35 for transporting the object w between the load-lock chamber 60 and the high pressure treatment chamber 10 is provided in the transportation chamber 30. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005033086(A) 申请公布日期 2005.02.03
申请号 JP20030272539 申请日期 2003.07.09
申请人 TOKYO ELECTRON LTD 发明人 NAKAO MASARU;TAKAHASHI NOBUAKI
分类号 H01L21/31;C23C16/44;C23C16/455;C23C16/54;H01L21/00;H01L21/205;H01L21/324;H01L21/677;(IPC1-7):H01L21/31 主分类号 H01L21/31
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