发明名称 |
FORMING METHOD OF POLISHING PAD WITH PLURALITY OF CIRCULAR GROOVES AND POLISHING PAD STRUCTURE |
摘要 |
PURPOSE: A structure and a method for forming a polishing pad are provided to increase efficiency of a slurry and to reduce costs by forming circular grooves on the polishing pad and by inserting a pad substance in the groove. CONSTITUTION: A polishing pad(22) of a CMP(Chemical Mechanical Polishing) equipment is prepared. A plurality of circular grooves are formed on the polishing pad. A pad substance(24) is inserted in the circular groove. The structure of the groove has K-groove shape. Polyurethane is used as the polishing pad, and polytex is used as the pad substance.
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申请公布号 |
KR20050012662(A) |
申请公布日期 |
2005.02.02 |
申请号 |
KR20030051800 |
申请日期 |
2003.07.26 |
申请人 |
MAGNACHIP SEMICONDUCTOR, LTD. |
发明人 |
YOON, IL YOUNG |
分类号 |
H01L21/304;(IPC1-7):H01L21/304 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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