发明名称 FORMING METHOD OF POLISHING PAD WITH PLURALITY OF CIRCULAR GROOVES AND POLISHING PAD STRUCTURE
摘要 PURPOSE: A structure and a method for forming a polishing pad are provided to increase efficiency of a slurry and to reduce costs by forming circular grooves on the polishing pad and by inserting a pad substance in the groove. CONSTITUTION: A polishing pad(22) of a CMP(Chemical Mechanical Polishing) equipment is prepared. A plurality of circular grooves are formed on the polishing pad. A pad substance(24) is inserted in the circular groove. The structure of the groove has K-groove shape. Polyurethane is used as the polishing pad, and polytex is used as the pad substance.
申请公布号 KR20050012662(A) 申请公布日期 2005.02.02
申请号 KR20030051800 申请日期 2003.07.26
申请人 MAGNACHIP SEMICONDUCTOR, LTD. 发明人 YOON, IL YOUNG
分类号 H01L21/304;(IPC1-7):H01L21/304 主分类号 H01L21/304
代理机构 代理人
主权项
地址