| 摘要 |
<p>PROVIDED IS AN EPOXY RESIN COMPOSITION COMPRISING:(A)AN EPOXY COMPOUND REPRESENTED BY THE GENERAL FORMULA (1):(FORMULA 1)WHEREIN, R1 TO R9 REPRESENT EACH INDEPENDENTLY A HYDROGEN ATOM, AN ACYCLIC ALKYL GROUP HAVING 1 TO 6 CARBON ATOMS, A SUBSTITUTED OR UNSUBSTITUTED PHENYL GROUP OR A HALOGEN ATOM,(B)A POLYFUNCTIONAL EPOXY COMPOUND HAVING A FUNCTIONAL GROUP NUMBER OF TWO OR MORE, AND(C)AN EPOXY CURING AGENT CONTAINING A PHENOLIC HYDROXYL GROUP,WHEREIN THE PROPORTION OF THE EPOXY COMPOUND (A) IS FROM 1 TO 99BY WEIGHT BASED ON THE TOTAL WEIGHT OF THE EPOXY COMPOUNDS (A) AND (B). THE EPOXY RESIN COMPOSITION HAS LOW MOISTURE ABSORPTION AND OTHER PROPERTIES IN WELL-BALANCED PARTICULARLY AS A MATERIAL FOR ENCAPSULATING ELECTRONIC PARTS.</p> |
