| 摘要 |
The invention relates to a semiconductor device with a semiconductor element (12), in particular, a power laser diode bar, arranged on a cooling element (20), whereby said cooling element (20) comprises a cooling channel (26) in the interior thereof, for the introduction of a coolant. The cooling channel (26) comprises microstructures in at least one region (32) for an effective heat transfer to the coolant. The semiconductor element (12) essentially completely overlaps the region (32) of the cooling channel (26) comprising the microstructures. An intermediate support (16) is arranged between the semiconductor element (12) and the cooling element (20), which is arranged and embodied to compensate for the mechanical tensions arising between the semiconductor element (12) and the cooling element (20) as a result of differing thermal expansions of the semiconductor element (12) and the cooling element (12). The material of the cooling element (20) has a particularly preferred high modulus of elasticity such that the compensation essentially occurs within the elastic expansion region. |
