| 摘要 |
PROBLEM TO BE SOLVED: To provide semiconductor-manufacturing equipment where efficiency in a polishing process to an edge surface is improved, and to provide a method for manufacturing a semiconductor device using the equipment. SOLUTION: The equipment is provided with a polishing roll 11 for polishing the edge surface of a semiconductor wafer 8 by rotation. As for the position of the roll 11 during the polishing when the tangent of the semiconductor wafer 8 at a polishing position is set to be an X-axis, an angleϕ2 formed by the X-axis and the rotary shaft of the role 11 is designated to be other than 90°. Then the equipment comprising a constitution like this is applied to a device process step, etc. COPYRIGHT: (C)2005,JPO&NCIPI
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