ELECTROPLATING METHOD, AND ELECTROPLATING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a technique where the formation of pinholes in a plating film can be prevented by effectively removing organic foreign matter in a plating liquid at a low cost. SOLUTION: The electroplating apparatus 100 is provided with: a plating tank 1 filled with a plating liquid; and a pair of anodes 7 and a cathode 9 dipped into the plating liquid 50 during plating. A magnet 11 is arranged inside the plating tank 1. The magnet 11 has a magnetic force of a magnitude which is enough to prevent an organic matter/metal joined body from being detached after it is attracted to the magnet (generally,≥0.25 teslas as surface magnetic flux density). COPYRIGHT: (C)2005,JPO&NCIPI