发明名称 METHOD FOR ELECTROPLATING GOLD
摘要 In an improved gold plating process the alkali metal concentration in the bath is maintained substantially constant during the plating operation by contacting the plating bath with an ammoniated cation exchange resin to replace alkali metal ions with ammonium ions and operating the ion exchanged plating bath at 60 DEG -90 DEG C. This process is particularly applicable when heavy coatings are desired, for example, in electroforming processes.
申请公布号 US3637473(A) 申请公布日期 1972.01.25
申请号 USD3637473 申请日期 1969.07.03
申请人 ENGELHARD MINERALS & CHEMICALS CORP. 发明人 LAWRENCE GREENSPAN;HEINRICH K. STRASCHIL
分类号 C25D3/48;B01J39/04;C25D21/22;(IPC1-7):C23B5/28;B01K3/00 主分类号 C25D3/48
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