SUBSTRATE CLEANING APPARATUS HAVING CLEANING UNIT WITH PROCESSING BATHS ARRANGED IN TWO LINES AND METHOD THEREOF

摘要

PURPOSE: A substrate cleaning apparatus and a method thereof are provided to reduce foot print of the apparatus regardless of dealing of a large-sized wafer and to improve throughput by arranging a plurality of processing baths in two lines. CONSTITUTION: A substrate cleaning apparatus(100) includes a loading/unloading unit(110), an aligning unit(120) for aligning wafers and a cleaning unit(130) for cleaning the wafers. The cleaning unit includes a first processing part(134) with first processing baths, a second processing part(144) with second processing baths and an interface part(150) for transferring the wafers between the first and second processing parts. The wafers are cleaned along a predetermined transfer route formed like a loop shape. The first and second processing parts are arranged in two lines between the aligning unit and the interface part.