| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a distance-measuring apparatus for reducing the influence of thermal expansion and contraction using a simple configuration. <P>SOLUTION: The distance-measuring apparatus comprises a package 10, a semiconductor chip 30, an optical case 50, a lens holder 60, and first and second lenses 71, 72. In this case, the coefficient of thermal expansion of the lens holder 60 is nearly the same as that of the semiconductor chip 30. Error in distance measurement with respect to changes in temperature is small, thus effectively providing distance information to a target in a device for recording an image, especially in equipment such as a camera, where the size of a light-receiving element surface is small, the size of a light-receiving element alone is small, and the margin of depth of focus is small as in a digital camera. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
