| 摘要 |
A first cermet layer, constituting a first wiring pattern, and a second cermet layer, constituting an insulating layer filling gaps in the first wiring pattern, are formed on a ceramic substrate. Thereafter, the first and second cermet layers are fired to simultaneously produce the first wiring pattern and the insulating layer. Next, a PZT paste constituting a piezoelectric/electrostrictive layer is formed and thereafter fired to produce the piezoelectric/electrostrictive layer. Thereafter, a third cermet layer, constituting a second wiring pattern, is formed and fired to produce the second wiring pattern, thereby fabricating a wiring board.
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