| 摘要 |
PURPOSE: Provided is a high insulation resin composition for extrusion coating and extrusion lamination, which has excellent electrical insulation property and maintains processability comparable to that of a conventional resin composition, and thus is useful for packaging materials for electronic products and semiconductors. CONSTITUTION: The high insulation resin composition for extrusion coating and extrusion lamination comprises a low-density polyethylene(LDPE) resin or ethylene vinyl acetate(EVA) resin as a base resin and a polymethylpentene(PMP) resin, wherein the mixing ratio of the base resin to polymethylpentene resin is 1:99-99:1 on the weight basis. Particularly, the LDPE resin has a melt index of 2-30 g/10 min and a density of 0.80-0.95 g/cm¬3, and the PMP resin has a melt index of 2-30 g/10 min.
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