发明名称 |
Circuit board with in-built electronic component and method for manufacturing the same |
摘要 |
A circuit board with an built-in electronic component according to the present invention includes an insulating layer, a first wiring pattern provided on a first main surface of the insulating layer, a second wiring pattern provided on a second main surface different from the first main surface of the insulating layer, and an electronic component such as a semiconductor chip or the like provided in an internal portion of the insulating layer. The electronic component includes a first external connection terminal formed on a first surface and a second external connection terminal formed on a second surface different from the first surface. The first external connection terminal is connected electrically to the first wiring pattern, and the second external connection terminal is connected electrically to the second wiring pattern.
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申请公布号 |
US2005006142(A1) |
申请公布日期 |
2005.01.13 |
申请号 |
US20040888140 |
申请日期 |
2004.07.09 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
ISHIMARU YUKIHIRO;NISHIYAMA TOUSAKU;SUGAYA YASUHIRO;ASAHI TOSHIYUKI |
分类号 |
H01L23/538;H01L25/065;H05K1/18;H05K3/20;H05K3/40;H05K3/46;(IPC1-7):H05K1/11 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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