METHOD FOR FORMING RESIST PATTERN OF SEMICONDUCTOR DEVICE TO PREVENT RESIST PATTERN FROM COLLAPSING WHEN SUBSTRATE IS ROTATED IN DRY PROCESS

摘要

PURPOSE: A method for forming a resist pattern of a semiconductor device is provided to prevent a resist pattern from collapsing when a substrate is rotated in a dry process by using an IPA(isopropyl alcohol) solution with low surface tension in a process for cleaning the resist pattern and by performing an ultraviolet exposure process on the cleaned resist pattern. CONSTITUTION: Resist is formed on a substrate. A soft bake process is performed on the resist. An exposure process is performed on the soft-baked resist. A PEB(post exposure bake) treatment is performed on the exposed resist. The PEB-treated resist is developed. The developed resist is cleaned twice. An ultraviolet exposure process is performed to harden the cleaned resist. A dry process is performed on the resist processed by the ultraviolet exposure.