| 发明名称 |
METHOD AND DEVICE FOR MANUFACTURING THIN WIRE CHIP |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a material for a thin wire chip capable of manufacturing a high-quality and low-cost fine metal ball. <P>SOLUTION: The problem can be solved by cutting a twisted wire to at least two thin wires twisted in a predetermined length in a longitudinal direction. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
| 申请公布号 |
JP2005005532(A) |
申请公布日期 |
2005.01.06 |
| 申请号 |
JP20030168175 |
申请日期 |
2003.06.12 |
| 申请人 |
HITACHI METALS LTD |
发明人 |
NISHI YUICHI;MIKAMOTO TSUKASA |
| 分类号 |
B21F7/00;B21F11/00;B21F99/00;B22F9/04;B23K35/40;H01L21/60 |
主分类号 |
B21F7/00 |
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