发明名称 Multi-layer printed circuit board and the method for coupling optical signals between layers of multi-layer printed circuit board
摘要 Disclosed herein is an optical signal coupling block, and a multi-layer printed circuit board and the method for coupling optical signals between layers of a multi-layer printed circuit board (PCB) using optical signal coupling blocks. The optical signals between the layers are coupled through the steps of forming a plurality of optical via holes in the multi-layer PCB to which optical waveguides for transmitting optical signals are attached; inserting the optical signal coupling blocks into the plural optical via holes such that the optical signal coupling blocks are connected to the optical waveguides to transmit the optical signals; forming at least one connection part to couple optical signals between the optical waveguides and the optical signal coupling blocks; and interconnecting the optical waveguides and the optical signal coupling blocks by aligning positions of the optical waveguides and the optical signal coupling blocks.
申请公布号 US6839476(B2) 申请公布日期 2005.01.04
申请号 US20030417357 申请日期 2003.04.16
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM YOUNG-WOO;RHEE BYOUNG-HO;YANG DEK-GIN;CHO YOUNG-SANG;YIM KYU-HYOK
分类号 G02B6/42;G02B6/43;(IPC1-7):G02B6/12 主分类号 G02B6/42
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