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发明名称
Mikromoduulin liitosjalka ja liitosmenetelmä
摘要
申请公布号
FI20030994(A)
申请公布日期
2005.01.03
申请号
FI20030000994
申请日期
2003.07.02
申请人
SELMIC OY,
发明人
HENRIKSSON,MARKKU
分类号
H01L21/60;H01L23/12;H05K;(IPC1-7):H01L21/60
主分类号
H01L21/60
代理机构
代理人
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