发明名称 A mounting structure of a wireless module
摘要 A box-shaped cover (4) has leg portion (4b) projected downward from cover portion (4a). A pair of through-holes (1a,6a) for inserting the leg portion are provided in circuit board (1) and motherboard (6), respectively. The leg portions are soldered to the circuit board and motherboard at the through-holes or at position close to through-holes in a state that the leg portions are inserted into through-holes.
申请公布号 EP1399006(A3) 申请公布日期 2004.12.29
申请号 EP20030255690 申请日期 2003.09.11
申请人 ALPS ELECTRIC CO., LTD. 发明人 WATANABE, HIDEKI;MATSUNO, SATORU
分类号 H05K1/14;H05K3/34;H05K5/00;H05K9/00 主分类号 H05K1/14
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