| 摘要 |
The present invention relates to a thermoformable, multilayer, co-extruded adhesive-free and EVOH-free film containing polyamide, polyolefins, and/or copolymers based on olefins. This film is particularly suitable for the packaging of products that have been subjected to a heat treatment in thermoformed films. The films are characterised by an outer layer of polyamide and a second outer layer of polyolefins or coploymers based on olefins, wherein the film composite does not delaminate even at temperatures between 50° C. and 150° C. |
