发明名称 DROPLET INJECTION PRODUCTION APPARATUS, PATTERN WIRING BOARD AND DEVICE BOARD PRODUCED THEREBY
摘要 PROBLEM TO BE SOLVED: To provide a droplet injection production apparatus capable of producing a pattern wiring board or a device board, which are high in quality, high in precision and high in reliability, in a high yield and having reliability in the long term use, and to provide the pattern wiring board or the device board produced by the production apparatus and imparted with a high precision, high quality and high reliability function. SOLUTION: A part of corner sections in an electrode pattern, which is connected to a pattern wiring or a device formed by injecting a fine particle-containing solution on a substrate with the action force of mechanical displacement, is chamfered. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004351298(A) 申请公布日期 2004.12.16
申请号 JP20030150706 申请日期 2003.05.28
申请人 RICOH CO LTD 发明人 SEKIYA TAKURO
分类号 B41J2/01;B05C5/00;B05D1/26;G09F9/00;H01L51/50;H05B33/02;H05B33/10;H05B33/14;H05K3/10;(IPC1-7):B05C5/00 主分类号 B41J2/01
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