发明名称 Semiconductor device and method of manufacturing the same
摘要 Disclosed is a semiconductor device comprising a semiconductor substrate, a gate electrode, a first insulating film formed between the semiconductor substrate and the gate electrode, and a second insulating film formed along a top surface or a side surface of the gate electrode and including a lower silicon nitride film containing nitrogen, silicon and hydrogen and an upper silicon nitride film formed on the lower silicon nitride film and containing nitrogen, silicon and hydrogen, and wherein a composition ratio N/Si of nitrogen (N) to silicon (Si) in the lower silicon nitride film is higher than that in the upper silicon nitride film.
申请公布号 US2004251521(A1) 申请公布日期 2004.12.16
申请号 US20040880508 申请日期 2004.07.01
申请人 发明人 TANAKA MASAYUKI;OZAWA YOSHIO;SAIDA SHIGEHIKO;GODA AKIRA;NOGUCHI MITSUHIRO;MITANI YUICHIRO;TSUNASHIMA YOSHITAKA
分类号 H01L21/283;H01L21/28;H01L21/285;H01L21/314;H01L21/318;H01L21/336;H01L21/60;H01L21/768;H01L21/8242;H01L21/8247;H01L27/108;H01L27/115;H01L29/41;H01L29/423;H01L29/49;H01L29/51;H01L29/78;H01L29/788;H01L29/792;(IPC1-7):H01L23/58 主分类号 H01L21/283
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