发明名称 |
ELECTRICAL ASSEMBLY AND DIELECTRIC MATERIAL |
摘要 |
<p>An electrical assembly includes an electrical component contained within a housing and surrounded by a dielectric electrical insulating material. The dielectric material fills the space between the electrical component and the housing to eliminate air gaps or spaces and to surround the electrical component. The dielectric material is formed from a curable resin composition that includes a base resin, such as an epoxy resin, a flexibilizing agent, a curing agent and an amount of a resilient and compressible filler. The resilient and compressible filler is particles of thermoplastic microballoons having a particle size of about 90 microns to about 110 microns.</p> |
申请公布号 |
WO2004108403(A1) |
申请公布日期 |
2004.12.16 |
申请号 |
WO2004US16875 |
申请日期 |
2004.05.28 |
申请人 |
HUBBELL INCORPORATED |
发明人 |
RINEHART, WILLIAM;DAVIS, BRADLEY |
分类号 |
H01H33/662;H01R4/70;(IPC1-7):B32B3/26 |
主分类号 |
H01H33/662 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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