Production of conducting marking material for circuit boards comprises applying layer of fine metal powder, especially copper powder and carbon particles, onto surface of substrate, and further coating with copper

摘要

The production of a conducting marking material, especially copper conducting pathways, on an insulating substrate e.g. plastic, glass or ceramic comprises applying a layer of fine metal powder, especially copper powder, having a grain size of 0.1-30 Microm and carbon particles having a grain size of less than 1 Microm onto the surface of a substrate, and further coating with copper to a required thickness. The carbon particles are present in an amount of 0.1-20, preferably 2-5 wt.%. An independent claim is also included for a device for carrying out the above process.